SC-10C SILICON WAFER LASER CUTTING MACHINE

1.Dual station non-stop feeding
2.Compatible with 156-218mm silicon wafers
3.Direct cutting without the need to break pieces, cutting surface without burrs

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Tel:86-510-86685699 / 86-18015368765

E-mailShuobang19@163.com

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Product description

参数

SC-10C sillicon wafer laser cutting machine adopts advanced laser technolgy, which is suitable for slicing monocrystalline silicon slices and can cut straght lines and chamfering angles. Monocrystalline silicon slice cut directly, cutting surface without burr, The equipment can automatically complete the feeding,cutting, separation, waste collection,finished product blanking box automatic production and processing

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